Semiconductor device including a buffer layer structure for reducing stress

ABSTRACT

A semiconductor device includes a semiconductor chip, wiring that is included in the semiconductor chip and has a coupling part between parts with different widths, a pad being formed above the wiring and in a position overlapping the coupling part, a bump being formed on the pad, a buffer layer being formed in a position between the coupling part and the pad so as to cover the entire coupling part, and inorganic insulating layers being formed between the wiring and the buffer layer and between the buffer layer and the pad, respectively. The buffer layer is made of a material other than resin and softer than the inorganic insulating layer.

This application is a continuation of U.S. patent application Ser. No.14/252,047 filed Apr. 14, 2014, now U.S. Pat. No. 8,952,554 issued Feb.10, 2015; which is a continuation of U.S. patent application Ser. No.14/067,404 filed Oct. 30, 2013, now U.S. Pat. No. 8,742,601issued Jun.3, 2014; which is a continuation of U.S. patent application Ser. No.11/738,266 filed on Apr. 20, 2007, now U.S. Pat. No. 8,614,513 issuedDec. 24, 2013, which claims priority to Japanese Patent Application No.2006-128360 filed on May 2, 2006, the entire disclosures of which areexpressly incorporated by reference herein.

TECHNICAL FIELD

The present invention relates to a semiconductor device.

RELATED ART

A semiconductor chip as an integrated circuit chip includes multilayeredwiring. Some pieces of wiring have a part with a large width and a partwith a small width. Intensive stress is apt to be applied to a couplingpart between such parts with different widths. In particular, sincepolysilicon wiring drawn out of a gate electrode formed in a lowermostlayer of a semiconductor chip has poorer ductility than metal, there hasbeen a problem that a crack is apt to occur in a coupling part of thepolysilicon wiring, thereby causing a break. Resistive elements, whichare made of polysilicon as well, have had a similar problem. Forexample, see JP-A-2002-319587.

SUMMARY

An advantage of the invention is to reduce stress to be applied to acoupling part between parts with different widths of wiring or aresistive element.

(1) According to an aspect of the invention, a semiconductor deviceincludes a semiconductor chip, wiring that is included in thesemiconductor chip and has a coupling part between parts with differentwidths, a pad being formed above the wiring and in a positionoverlapping the coupling part, a bump being formed on the pad, a bufferlayer being formed in a position between the coupling part and the padso as to cover the entire coupling part, and inorganic insulating layersbeing formed between the wiring and the buffer layer and between thebuffer layer and the pad, respectively. The buffer layer is made of amaterial other than resin and softer than the inorganic insulatinglayer.

According to the aspect of the invention, even though a force is appliedto the coupling part between the parts with different widths by thebump, the force is absorbed by the buffer layer. This allows less stressto be applied to the coupling part.

(2) In the semiconductor device according to the aspect of theinvention, the wiring may be used as a resistive element.

(3) In the semiconductor device according to the aspect of theinvention, the buffer layer may be made of a conductive material andelectrically coupled to the wiring.

(4) In the semiconductor device according to the aspect of theinvention, the wiring may be made of polysilicon.

BRIEF DESCRIPTION OF THE DRAWINGS

The invention will be described with reference to the accompanyingdrawings, wherein like numbers reference like elements.

FIG. 1A is a sectional view showing a part of a semiconductor deviceaccording to a first embodiment of the invention, and FIG. 1B is a planview showing a part of the semiconductor device shown in FIG. 1A.

FIGS. 2A and 2B show modifications of the semiconductor device shown inFIG. 1B.

FIGS. 3A and 3B are drawings showing a semiconductor device according toa second embodiment of the invention, and FIG. 3A is a sectional viewtaken along line IIIA-IIIA of FIG. 3B.

FIG. 4A is s sectional view showing a part of a semiconductor deviceaccording to a third embodiment of the invention, and FIG. 4B is a planview showing a part of the semiconductor device shown in FIG. 4A.

FIG. 5A is a sectional view showing a part of a semiconductor deviceaccording to a fourth embodiment of the invention, and FIG. 5B is a planview showing a part of the semiconductor device shown in FIG. 5A.

DESCRIPTION OF EXEMPLARY EMBODIMENTS

Embodiments of the invention will now be described with reference to theaccompanying drawing.

First Embodiment

FIG. 1A is a sectional view showing a part of a semiconductor deviceaccording to a first embodiment of the invention. FIG. 1B is a plan viewshowing a part of the semiconductor device shown in FIG. 1A. Asemiconductor chip 10 includes an integrated circuit (for example,field-effect transistor 20).

The field-effect transistor 20 includes diffusion layers 21, 22 servingas a source and a drain, contact parts 23, 24 for making contact withthe diffusion layers 21, 22, and a gate electrode 25. Applying a voltageto the gate electrode 25 forms a channel 26 to pass current.

The semiconductor chip 10 includes wiring 30 that is coupled to thediffusion layers 21, 22 serving as a source and a drain via the contactparts 23, 24.

The semiconductor chip 10 includes first wiring 25 a that is coupled tothe gate electrode 25 and has a first width, second wiring 25 b that hasa second width, and a coupling part 34 between the first wiring 25 a andsecond wiring 25 b. The first width is smaller than the second width.The first wiring 25 a, second wiring 25 b, and coupling part 34 may aform a T shape as shown in FIG. 1B, an L shape as a modification asshown in FIG. 2A, or a cross as shown in FIG. 2B. The first wiring 25 aand second wiring 25 b may be made of polysilicon, aluminum (Al),aluminum alloy, or the like. The first wiring 25 a and second wiring 25b may be made of polysilicon and then used as resistive elements. It isknown that application of a force to the first wiring 25 a and secondwiring 25 b which have different widths causes intensive stress to beapplied to the coupling part 34.

Disposed in a position (above the coupling part 34) overlapping thecoupling part 34 is a pad 40 that is electrically coupled to theintegrated circuit. The pad 40 may include in an uppermost layer thereofa barrier metal layer made of TiN, TiW, or the like. Such a barriermetal layer can prevent the material of a component, formed thereon fromdiffusing into the pad 40. The pad 40 can be formed by sputtering.

Wiring that includes the pad 40 as a part thereof is covered with apassivation film 42 except for at least a part of the pad 40 (e.g.center part). The passivation film 42 is made of an inorganic materialsuch as SiO₂ or SiN. It is known that inorganic materials are harderthan metal such as Au or Al.

Formed on the pad 40 is a bump 44 that is made of metal such as Au. Auis softer than TiN or TiW. The bump 44 may partially he placed on thepassivation film 42 and can be formed by electrolytic plating.

Disposed between the coupling part 34 and pad 40 is a buffer layer 50that is formed so as to cover the entire coupling part 34. Formedbetween the first wiring 25 a and second wiring 25 b and the bufferlayer 50 and between the buffer layer 50 and pad 40 are inorganicinsulating layers 60 and 62, respectively. The inorganic insulatinglayers 60 and 62 are made of an inorganic material such as an oxidefilm. Inorganic materials are known to be harder than metal such as Auor Al. The buffer layer 50 is made of a material (e.g., metal) otherthan resin and softer than the inorganic insulating layers 60 and 62.The buffer layer 50 may be made of a material identical to at least anyone of the wiring 30 and pad 40.

According to this embodiment, even though a force is applied to thecoupling part 34 between the parts with different widths by the bump 44,the force is absorbed by the buffer layer 50. This allows less stress tobe applied to the coupling part 34.

Second Embodiment

FIG. 3A is a sectional view showing a part of a semiconductor deviceaccording to a second embodiment of the invention. FIG. 3B is a planview showing a part of the semiconductor device shown in FIG. 3A.Specifically, FIG. 3A is a sectional view taken along line IIIA-IIIA ofFIG. 3B.

The semiconductor device 110 according to this embodiment includes firstwiring 125 a that has a first width, second wiring 125 b that has asecond width, and a coupling part 134 between the first wiring 125 a andsecond wiring 125 b.

A buffer layer 150 is made of a conductive material and electricallycoupled to the second wiring 125 b. Specifically, a contact part 70 isdisposed between the buffer layer 150 and second wiring 125 b so as toelectrically couple them. The second width of the second wiring 125 b ismade larger than the first width of the first wiring 125 a so as todispose the contact part 70 on the second wiring 125 b. The buffer layer150 is formed so as to cover the coupling part 134. The buffer is formedbetween the coupling part 134 and pad 140. Other features correspond tothose described in the abovementioned embodiment. The same goes for theoperation and effect of this embodiment.

Third Embodiment

FIG. 4A is a sectional view showing a part of a semiconductor deviceaccording to a third embodiment of the invention. FIG. 4B is a plan viewshowing a part of the semiconductor device shown in FIG. 4A. Thesemiconductor device according to this embodiment includes asemiconductor chip 210. The semiconductor chip 210 includes anintegrated circuit (e.g. field-effect transistor 220).

The field-effect transistor 220 includes diffusion layers 221, 222serving as a source and a drain, contact parts 223, 224 for makingcontact with the diffusion layers 221, 222, and a gate electrode 225.Applying a voltage to the gate electrode 225 forms a channel 226 to passcurrent.

The semiconductor chip 210 includes wiring 230 that has parts 231, 232with different widths and a coupling part 234 between these parts. Thepart 232 with a smaller width is a wiring line. The contact part 223 isdisposed on the part 231 with a larger width. The parts 231, 232 withdifferent widths and the coupling part 234 may form any of an L shape, aT shape, and a cross. It is known that application of a force to thewiring 230 having the parts 231, 232 with different widths causesintensive stress to be applied to the coupling part 234.

Disposed in a position (above the coupling part 234) overlapping thecoupling part 234 is a pad 240 that is electrically coupled to theintegrated circuit. The pad 240 may include in an uppermost layerthereof a barrier metal layer made of TiN, TiW, or the like. The barriermetal layer can prevent the material of a component formed thereon fromdiffusing into the pad 240. The pad 240 can be formed by sputtering.

Wiring that includes the pad 240 as a part thereof is covered with apassivation film 242 except for at least a part of the pad 240 (e.g.center part). The passivation film 242 is made of an inorganic materialsuch as SiO₂ or SiN. It is known that inorganic materials are harderthan metal such as Au or Al.

Formed on the pad 240 is a bump 244 that is made of metal such as Au. Auis softer than TiN or TiW. The bump 244 may partially be placed on thepassivation film 242 and can be formed by electrolytic plating.

Disposed between the coupling part 234 and pad 240 is a buffer layer 250that is formed so as to cover the entire coupling part 234. Formedbetween the wiring 230 and buffer layer 250 and between the buffer layer250 and pad 240 are inorganic insulating layers 260 and 262,respectively. The inorganic insulating layers 260 and 262 are made of aninorganic material such as an oxide film. Inorganic materials are knownto be harder than Au or Al. The buffer layer 250 is made of a material(e.g. metal) other than resin and softer than the inorganic insulatinglayers 260 and 262. The buffer layer 250 may be made of an identicalmaterial to at least any one of the wiring 230 and pad 240.

According to this embodiment, even though a force is applied to thecoupling part 234 between the parts with different widths by the bump244, the force is absorbed by the buffer layer 250. This allows lessstress to be applied to the coupling part 234.

Fourth Embodiment

FIG. 5A is a sectional view showing a part of a semiconductor deviceaccording to a fourth embodiment of the invention. FIG. 5B is a planview showing a part of the semiconductor device shown in FIG. 5A.

In this embodiment, a buffer layer 350 is made of a conductive materialand electrically coupled to wiring 330. Specifically, a contact part 270is disposed between the buffer layer 350 and the wiring 330 so as toelectrically couple them. The wiring 330 includes a first coupling part334 between parts 331, 332 with different widths and a second contactpart 335 between the part 332 and a part 333 that have different widths.Among the parts 332, 333, the part 333 has a larger width than that ofthe part 332 to dispose the contact part 270. The buffer layer 350 isformed so as to entirely cover both the first and second coupling parts334, 335. Other features correspond to those described in theabovementioned embodiments. The same goes for the operation and effectof this embodiment.

The invention is not limited to the abovementioned embodiments andvarious modifications can be made to these embodiments. For example, theinvention includes features substantially identical to those describedin the embodiments (for example, an identical feature in function,method, and result, or an identical feature in objective and result).The invention also includes features in which any non-essential part ofthe features described in the embodiments is replaced. The inventionalso includes features in which operation and effect identical to thosedescribed in the embodiments are demonstrated, or features in whichobjectives identical to those described in the embodiments can beachieved. The invention also includes features in which a well-knowntechnology is added to the features described in the embodiments.

What is claimed is:
 1. A semiconductor device comprising: asemiconductor chip having a laminating structure and a pad; a wiringthat is included in the semiconductor chip, the wiring having a firstwiring part and a second wiring part, a first width of the first wiringpart being different from a second width of the second wiring part, thewiring has a coupling part between the first wiring part and the secondwiring part; a buffer layer that is formed in a position between thecoupling part and the pad; and a contact part for making contact with adiffusion layer and the wiring; wherein, when the laminating structureis viewed with the semiconductor device oriented with the pad at the topportion, the pad is disposed above the coupling part, the diffusionlayer is formed below the wiring, and the buffer layer is arranged inoverlapping relation with the pad, the coupling part, the contact part,and the diffusion layer in a plan view from above the pad.
 2. Thesemiconductor device according to claim 1, wherein the wiring has atleast three terminating edges of the second wiring part arranged withinthe buffer layer in a plan view from above the pad.
 3. The semiconductordevice according to claim 1, wherein the wiring is made of aluminum (Al)or aluminum alloy.
 4. The semiconductor device according to claim 1,wherein the first wiring part, the second wiring part, and the couplingpart are formed in a substantially T-shaped conformation orsubstantially L-shaped conformation or substantially cross-shapedconformation.
 5. The semiconductor device according to claim 1, whereinthe semiconductor device further comprises an inorganic insulating layerthat is formed between the pad and the buffer layer.
 6. Thesemiconductor device according to claim 1, wherein the buffer layer ismade of a material other than resin and softer than the inorganicinsulating layer.
 7. The semiconductor device according to claim 1,wherein the semiconductor device further comprises a passivation filmmade of SiN that covers the pad except at least a part of the pad. 8.The semiconductor device according to claim 7, wherein the semiconductordevice further comprises a bump that is placed on the pad and partiallyplaced on the passivation film.
 9. The semiconductor device according toclaim 8, wherein the bump is made of Au.
 10. The semiconductor deviceaccording to claim 1, wherein the wiring further includes a third wiringpart, a third width of the third wiring part being different from thefirst width of the first wiring part, and between the first wiring partand the third wiring part, the wiring includes an additional couplingpart.
 11. The semiconductor device according to claim 10, wherein thebuffer layer is formed so as to entirely cover both the coupling partand the additional coupling part in a plan view from above the pad. 12.The semiconductor device according to claim 1, wherein the semiconductordevice further comprises an inorganic insulating layer that is formedbetween the wiring and the buffer layer.
 13. The semiconductor deviceaccording to claim 12, wherein the semiconductor device furthercomprises an inorganic insulating layer that is formed between the padand the buffer layer.
 14. The semiconductor device according to claim 1,wherein the buffer layer is made of a conductive material.
 15. Thesemiconductor device according to claim 14, wherein the buffer layer iscoupled to the wiring.
 16. The semiconductor device according to claim15, wherein an additional coupling part is arranged between the bufferlayer and the wiring so as to electrically couple the buffer layer andthe wiring.